Principal Packaging Engineer - Far Rockaway New York

Company: VirtualVocations
Location: Far Rockaway, New York
Posted On: 05/05/2025

A company is looking for a Principal Packaging Engineer who will develop and refine Chip-on-Wafer-on-Substrate technology.
Key Responsibilities

Innovate and enhance CoWoS packaging processes to improve chip performance, power efficiency, and reliability
Collaborate with design, test, and manufacturing teams for effective chip-package integration
Lead failure analysis and drive yield improvements across packaging processes

Required Qualifications

15 years of hands-on experience in advanced semiconductor packaging and interconnect processes
Proven expertise in CoWoS / FOCoS, or FOWLP; familiarity with EMIB, InFO, and advanced 2.5D/3D integration technologies is a plus
Strong knowledge of thermal management, reliability testing, and signal/power integrity challenges
Experience working with TSMC and leading OSATs
Bachelor's or Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field More...

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