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Optical Packaging Engineer - Palo Alto California
Company: PsiQuantum Location: Palo Alto, California
Posted On: 04/25/2024
PsiQuantum is on a mission to build the world's first utility-scale, 1 million-plus qubit quantum computer, powered by breakthroughs in silicon photonics and quantum architecture. We were founded in 2015 by the world's foremost experts in photonic quantum computing and have assembled a world class team dedicated to bringing the world-changing benefits of quantum computing into reality. Quantum computing is anticipated to unlock the solutions to otherwise impossible computational tasks, with impact across science, technology, and business. By harnessing the laws of quantum physics, quantum computers are expected to dramatically outperform even the most powerful existing (or future) supercomputers and offer the potential to enable extraordinary advances across a broad range of applications including climate, energy, healthcare, finance, agriculture, transportation, materials design, and more, as well as deliver entirely new industries. PsiQuantum is uniquely positioned to deliver on the promise of quantum computing. We have already demonstrated that it's possible to manufacture core quantum components using the standard and scalable manufacturing processes of a world-leading semiconductor fab. Our team is working across the full stack of quantum computing, from hardware design, manufacturing, and packaging through to quantum architecture and quantum algorithms. We're a highly integrated, collaborative group and love tackling problems that span across interfaces. There's more work to be done and we are looking for exceptional talent to join us on this extraordinary journey! Job Summary: The Optical Packaging Engineer is responsible for developing & implementing a high-performance & robust fiber-to-chip package and a scalable packaging process for optical systems comprised of optical fibers attached to a variety of chip-based photonic integrated circuits. Responsibilities: Develop an optical package and fiber-to-chip alignment scheme that allows for high alignment accuracy and scalable assembly. Collaborate with optical design team to understand the design constraints and communicate the packaging requirements. Establish version-controlled packaging-related design rules & standard packaging process flow. Work with external vendors and suppliers to source required materials and provide feedback on evolving requirements. Experience/Qualifications: |
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